Thin Film Equipment

Process Technology

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    Electron Beam Evaporation

    A stream of high energy electrons heats up the source to generate vapors that condense onto a substrate to form a thin film. HHV provides electron guns from single pocket to multi pocket sources with large capacity for a range of applications from R&D to multi-layer depositions that require higher film thicknesses.

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    Ion Beam Sputtering

    Ion beam sputtering uses an ion source to sputter target material to deposit thin films onto a substrate. This process allows for depositions to be carried out at better vacuum ranges resulting in films with improved adhesion, dense film structure, less defects, higher purity, and better controlled composition HHV offers ion beam sputtering systems for R&D and production applications.

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    PECVD

    Plasma enhanced chemical vapour deposition (PECVD) processes induce a chemical reaction between coupled electrodes which results in a thin film being deposited on a substrate. HHV offers PECVD systems in various configurations such as single, load-lock and multi-chamber cluster tools to suit customer needs.

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    Reactive Ion Etching

    Reactive Ion Etching (RIE) uses physical and chemical processes to etch away materials from surfaces of samples. In RIE, a gas glow discharge is created between two electrodes that creates ions of inert and reactive gases that remove materials from the substrate surface. This process is popularly used for machining and etching materials for high performance nano and micro scale device fabrication.

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    Atomic Layer Deposition

    Atomic layer deposition (ALD) is an advanced vapour phase deposition technique based on the sequential use of precursors and gives 100 percent conformal coverage and excellent thickness uniformity with pinhole free coatings. HHV offers highly cost effective thermal ALD tools with built-in process recipes and a user-friendly software interface.

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