Thin Film Equipment
Process Technology
Thermal Evaporation
Thermal evaporation involves heating a material inside a high vacuum chamber until it boils or sublimes, and then condenses on a substrate to form a thin film. HHV has been developing deposition systems with various types of crucibles, customized to customer needs.
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Electron Beam Evaporation
A stream of high energy electrons heats up the source to generate vapors that condense onto a substrate to form a thin film. HHV provides electron guns from single pocket to multi pocket sources with large capacity for a range of applications from R&D to multi-layer depositions that require higher film thicknesses.
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Magnetron Sputtering
Magnetron sputtering employs plasma to generate ions which bombard the surface of a ‘target’ which then sputters the thin film material on to a substrate. HHV offers a range of circular and linear magnetron sputter sources, engineered to meet R&D and production requirements.
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Effusion Cells
Effusion cells are highly controllable and efficient evaporation source for physical vapor deposition. HHV has been offering deposition systems with effusion sources for OLED, displays, solar cells and flexible electronic devices.
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Ion Beam Sputtering
Ion beam sputtering uses an ion source to sputter target material to deposit thin films onto a substrate. This process allows for depositions to be carried out at better vacuum ranges resulting in films with improved adhesion, dense film structure, less defects, higher purity, and better controlled composition HHV offers ion beam sputtering systems for R&D and production applications.
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Glow Discharge
During glow discharge cleaning a plasma is created to accelerate the release of adsorbed molecules from surfaces exposed to the plasma. The plasma can be created by using inert gases, Oxygen or mixtures of these gases based on the application. HHV offers a range of glow discharge cleaning devices for a range of requirements.
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PECVD
Plasma enhanced chemical vapour deposition (PECVD) processes induce a chemical reaction between coupled electrodes which results in a thin film being deposited on a substrate. HHV offers PECVD systems in various configurations such as single, load-lock and multi-chamber cluster tools to suit customer needs.
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Reactive Ion Etching
Reactive Ion Etching (RIE) uses physical and chemical processes to etch away materials from surfaces of samples. In RIE, a gas glow discharge is created between two electrodes that creates ions of inert and reactive gases that remove materials from the substrate surface. This process is popularly used for machining and etching materials for high performance nano and micro scale device fabrication.
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Atomic Layer Deposition
Atomic layer deposition (ALD) is an advanced vapour phase deposition technique based on the sequential use of precursors and gives 100 percent conformal coverage and excellent thickness uniformity with pinhole free coatings. HHV offers highly cost effective thermal ALD tools with built-in process recipes and a user-friendly software interface.
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